HPPC TECHs Blog

- Sekisui Mobility Solution - 安全(ADAS) Safety(ADAS)

Sekisui Mobility Solution - Safety(ADAS)-

The SEKISUI CHEMICAL Group provides materials that contribute to improving the reliability of ADAS devices, especially the bonding, heat dissipation, and molding technologies we have developed over time.

Challenge 安全(ADAS)

Challenge

With the evolution of ADAS (Advanced Driver-Assistance Systems), vehicles are being equipped with more and more electronic parts that work to achieve driver safety and comfort, and with this, a range of new issues are cropping up.

For example, we need methods to combat heat in order to prevent safety or performance drops due to the heat generated as electronic parts become more advanced and smaller, and to prevent operation errors due to interference from electromagnetic noise. So, there are increasing needs for heat dissipation and electromagnetic shielding in the materials that make up devices.
In particular, there is a strong demand that the performance, safety, and reliability of sensors parts such as radars and cameras that detect what is going on inside and outside the vehicle, and the ECU (Electronic Control Unit) that processes and judges information, be upgraded.

In addition, the increase in weight with these added parts means that even as vehicle electrification advances, there are impacts on range, so combining these parts with lightness is a key element.

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Solution - 安全(ADAS)

Solution

The SEKISUI CHEMICAL Group provides materials that contribute to improving the reliability of ADAS devices, especially the bonding, heat dissipation, and molding technologies we have developed over time.

Our lineup includes greases and sheet-type heat dissipation products that allow cooling for hot parts such as CPUs and GPUs, and housings for millimeter wave radar or in-vehicle cameras, allowing us to offer materials that combine flexibility, insulation, and are siloxane-free.

In addition, for thin noise-absorbing materials that use our sputtering technology and injection-molded products that balance heat dissipation with electromagnetic shielding, we have the technologies to lighten materials or parts by replacing the conventional metal or rubber parts.
Also, we shall contribute to improving the reliability of ADAS devices through sealing functions using bonding technology and gap control for PCBs (Printed Circuit Board) that are getting thinner through functional microparticles technology.

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Product list -安全(ADAS)

Product list

A list of 12 items within the safety (ADAS) category.

Thermal-conductive greases CGW® series
Heat dissipationHeat dissipation

Thermal-conductive greases CGW® series

Two-component silicone-based thermal conductive grease curing in room temperature
Potential applications : LiB
Manion HST - high property, high thermal sheet -
Heat dissipation

Manion HST - high property, high thermal sheet -

Thermal conductive sheet with high thermal conductivity, flexibility and adhesion
Potential applications : ECU
Injection molding with thermal-conductive and EMC shielding

Heat dissipationEMC measuresIncreased lightness

Injection molding with thermal-conductive and EMC shielding

Injection molding with high shielding and heat release properties achieved by our proprietary material technology
Potential applications : ECU
1-Part Heat-Curable Grease

Heat dissipation

1-Part Heat-Curable Grease

Thermal-conductive paste with heat dissipation, adhesion and insulation properties
Potential applications : Power semiconductor
Millimeter wave absorbing sheet - masa sorb -

EMC measures

Millimeter wave absorbing sheet - masa sorb -

Millimeter wave absorbing sheet for radar with wide bandwidth, wide angle, and high absorption performance
Potential applications : Noise absorption for millimeter-wave radar
Functional fine particles - Epowell GP series -

Gap forming & adhesion

Functional fine particles - Epowell GP series -

Heat-curable adhesive containing ultra-uniform particles
Potential applications : Securing ADAS components
Functional fine particles - Micropearl SOL -

Gap forming & adhesion

Functional fine particles - Micropearl SOL -

Solder balls with a polymer core for solder paste substitution
Potential applications : Ceramic BGA/CBGA
Solder anisotropic conductive paste - SACP -

Gap forming & adhesion

Solder anisotropic conductive paste - SACP -

Anisotropic conductive paste enabling metal bonding at low-temperature and low-pressure
Potential applications : Camera module connectivity, a connector substitute
SELFA - high adhesion easy removable UV tape -

Adhesion

SELFA - high adhesion easy removable UV tape -

UV irradiated release tape specializing in heat resistance, chemical resistance, and easy peeling
Potential applications : Semiconductor chips for ECU
UV curing adhesive Photolec A

Adhesion HMI functionality improvements

UV curing adhesive Photolec A

UV-curing adhesive with no oxygen inhibition and excellent reactivity
Potential applications : Securing the lens unit using UV-curing adhesive
UV curing adhesive Photolec E

Adhesion HMI functionality improvements

UV curing adhesive Photolec E

UV delayed curing adhesive that can be applied to UV-impermeable materials and UV-sensitive surfaces
Potential applications : Sealant for OLED display

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