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High Thermal Conductivity Heat Dissipation Sheet MANION™ Series
An ultra-high-thermal-conductivity carbon heat dissipation sheet created by magnetic field alignment technology
- Mobility
- Electronics
- Chip performance degradation due to high temperatures
- High heat dissipation by magnetic field orientation technology
- Technical information
- Document download
Chip performance degradation due to high temperatures
The advanced driver assistance systems (ADAS) devices needed for automated driving use powerful CPUs and GPUs.
As the amount and speed of information processing increases, the temperature of the chip rises, causing a significant drop in performance.
Materials that can withstand high-temperature environments and dissipate heat efficiently are in demand.
High heat dissipation by magnetic field orientation technology
By applying our unique magnetic field orientation technology, we have succeeded in producing a thermal conductive sheet that allows optimal use of the high-thermal conductivity of carbon fiber without sacrificing the flexibility and adhesive performance of the polymer.
This product is ideal for cooling high-heat sources such as CPUs and GPUs.
MANION-HST is a very thin sheet and can be used as an alternative to grease.
Technical information
Technical overview
High thermal endurance
-40℃ ～ 200℃
Extremely low thermal resistance
Carbon fiber ＋
Magnetic field orientation technology
High physical strength
Designed to withstand high pressure
Thin design
Extremely thin 0.12mm~
Technical details
High thermal endurance
Extremely low thremal resistance
contributes to grease substitution
High physical durability
| Existing product | MANION-HST | |
|---|---|---|
| 240 psi |  |
 |
| 1,000 psi |  |
 |
Thin design
Extremely thin, from 0.12 mm
Thickness adjustment according to design
Document download
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