Optimal Materials for the Next Generation of TechnologyElectronics Solution
We supply products such as fine particles, sealants and adhesives, and tapes and films that have functions including conductivity and insulation, thermal management, gap formation, and cushioning and protection for use in various types of displays, electrical devices, communications equipment, circuit boards, and semiconductors.
We offer a wide range of highly reliable products that can be used in wafer/chip manufacturing, package substrate manufacturing, and semiconductor back-end processes.
Continuously evolving display with higher image quality and performance.Sekisui Chemical Electronics materials will contribute to solving issues that arise with this evolution.
Achieves low insertion loss, high dielectric reliability and finer line and space manufactureability by Sekisui Chemical’s build-up film.
High-performance filler with uniformity, flexibility, and excellent dispersibility.
Realizing a new semiconductor process with UV tape that combines heat resistance and easy peelability.
News
- All
- CSR
- Pressrelease
- MIC
- 2026-09-01
Electronics
- We will exhibit at SEMICON TAIWAN 2026
- 2026-07-28
MIC Building / Infrastructure Electronics Mobility Packaging Health care
- Minase Innovation Center Website Renewal Announcement
- 2025-12-09
Electronics
- We will exhibit at SEMICON JAPAN 2025
- 2025-10-29
MIC Building / Infrastructure Electronics Mobility Packaging Health care
- Experience the future in a new exhibition space
- 2024-09-25
MIC Building / Infrastructure Electronics Mobility Packaging Health care
- 【MIC Event Report】MINASE INNOVATIONCENTER FACILITY TOUR REPORT
- 2022-01-20
CSR Building / Infrastructure Electronics Mobility Packaging Health care
- SEKISUI CHEMICAL selected as one of the 2022 Global 100 Most Sustainable Corporations in the World for the fifth year running
- 2023-03-20
Pressrelease Building / Infrastructure Electronics Mobility
- Notice Concerning the Release of the World’s First Transfer Tape with High Heat Resistance, Thin-film, Low VOC, and Adhesion to Rough Surfaces
- 2026-07-28
MIC Building / Infrastructure Electronics Mobility Packaging Health care
- Minase Innovation Center Website Renewal Announcement
- 2025-10-29
MIC Building / Infrastructure Electronics Mobility Packaging Health care
- Experience the future in a new exhibition space
- 2024-09-25
MIC Building / Infrastructure Electronics Mobility Packaging Health care
- 【MIC Event Report】MINASE INNOVATIONCENTER FACILITY TOUR REPORT
- 2024-08-06
MIC Building / Infrastructure Electronics Mobility Packaging Health care
- 【MIC Event Report】Effectuation Special Lecture
- 2024-06-14
MIC Building / Infrastructure Electronics Mobility Packaging Health care
- Held internal idea generation workshop
Technical column
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- 2026-09-25What Is IPX? SEKISUI Technologies for Achieving Waterproof Performance
- While IPX ratings indicate the waterproof performance of a finished product, material selection is also critical to achieving that performance. This article introduces the basics of IPX ratings and SEKISUI's foam materials, foam tapes, and adhesives that contribute to waterproof design.
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- 2026-09-10What Is Impact Resistance? Sekisui Technologies Supporting Electronic Devices
- An overview of the fundamentals of impact resistance required for electronic devices and the methods used to evaluate it. We also introduce products that leverage Sekisui's impact absorption technologies.
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- 2026-05-08Selection Guide for “Microparticles” to Achieve Precise Gap Control and Stress Relief
- A key material to solve design challenges in semiconductor packaging, electronic material bonding/adhesion, and adhesive coatings