Optimal Materials for the Next Generation of TechnologyElectronics Solution
We supply products such as fine particles, sealants and adhesives, and tapes and films that have functions including conductivity and insulation, thermal management, gap formation, and cushioning and protection for use in various types of displays, electrical devices, communications equipment, circuit boards, and semiconductors.
We offer a wide range of highly reliable products that can be used in wafer/chip manufacturing, package substrate manufacturing, and semiconductor back-end processes.
Continuously evolving display with higher image quality and performance.Sekisui Chemical Electronics materials will contribute to solving issues that arise with this evolution.
Achieves low insertion loss, high dielectric reliability and finer line and space manufactureability by Sekisui Chemical’s build-up film.
High-performance filler with uniformity, flexibility, and excellent dispersibility.
Realizing a new semiconductor process with UV tape that combines heat resistance and easy peelability.
News
- All
- CSR
- Pressrelease
- 2025-12-09
Electronics
- We will exhibit at SEMICON JAPAN 2025
- 2023-03-20
Pressrelease Building / Infrastructure Electronics Mobility
- Notice Concerning the Release of the World’s First Transfer Tape with High Heat Resistance, Thin-film, Low VOC, and Adhesion to Rough Surfaces
- 2022-01-20
CSR Building / Infrastructure Electronics Mobility Packaging Health care
- SEKISUI CHEMICAL selected as one of the 2022 Global 100 Most Sustainable Corporations in the World for the fifth year running
- 2022-01-20
CSR Building / Infrastructure Electronics Mobility Packaging Health care
- SEKISUI CHEMICAL selected as one of the 2022 Global 100 Most Sustainable Corporations in the World for the fifth year running
- 2023-03-20
Pressrelease Building / Infrastructure Electronics Mobility
- Notice Concerning the Release of the World’s First Transfer Tape with High Heat Resistance, Thin-film, Low VOC, and Adhesion to Rough Surfaces
Technical column
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- 2026-05-08Selection Guide for “Microparticles” to Achieve Precise Gap Control and Stress Relief
- A key material to solve design challenges in semiconductor packaging, electronic material bonding/adhesion, and adhesive coatings
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- 2026-04-07Why Is Debonding Important in Advanced Manufacturing Processes?
- What is debonding? Why is TBDB so critical in advanced manufacturing processes?
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- 2026-04-07A Complete Guide to Semiconductor Manufacturing Processes and Principles
- This article explains the sequence of semiconductor manufacturing processes, the industry value chain, and key packaging materials, along with answers to frequently asked questions.