Category
-
- 2026-05-08Selection Guide for “Microparticles” to Achieve Precise Gap Control and Stress Relief
- A key material to solve design challenges in semiconductor packaging, electronic material bonding/adhesion, and adhesive coatings
# Electronics
-
- 2026-04-07Why Is Debonding Important in Advanced Manufacturing Processes?
- What is debonding? Why is TBDB so critical in advanced manufacturing processes?
-
- 2026-04-07A Complete Guide to Semiconductor Manufacturing Processes and Principles
- This article explains the sequence of semiconductor manufacturing processes, the industry value chain, and key packaging materials, along with answers to frequently asked questions.
-
- 2026-03-30Bag-in-Box Containers: A Sustainable Solution for Efficient Liquid Packaging
- Bag-in-Box (BIB) is a packaging solution for storing and transporting liquids.
# Electronics
-
- 2026-03-30Clean Containers for High‑Purity Chemicals: Ideal for Storage and Transport
- Storage and transport of critical chemicals for semiconductor and electronics manufacturing.
# Electronics
-
- 2025-09-30Metal-plated particles with uniform particle size distribution
- Metal-plated Micropearl™ can be used for conduction between electronic devices and substrate, thermal conduction, gap formation, and others.
-
- 2025-09-30Plastic particles with uniform particle size distribution
- They can be used in a variety of applications including gap formation in automobile parts and optical components.
-
- 2025-09-30Next-generation display
- Continuously evolving display with higher image quality and performance Sekisui Chemical Electronics materials will contribute to solving issues that arise with this evolution
-
- 2025-09-30Proposals for Sekisui's Engineering Plastics
- Engineering plastics are excellent in heat resistance and electric properties among plastics, and they are superior as inner and peripheral materials for electrical and electronic components, OA equipment, transmission, etc.
