Technical column
Category
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- 2026-05-08Selection Guide for “Microparticles” to Achieve Precise Gap Control and Stress Relief
- A key material to solve design challenges in semiconductor packaging, electronic material bonding/adhesion, and adhesive coatings
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- 2026-04-07Why Is Debonding Important in Advanced Manufacturing Processes?
- What is debonding? Why is TBDB so critical in advanced manufacturing processes?
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- 2026-04-07A Complete Guide to Semiconductor Manufacturing Processes and Principles
- This article explains the sequence of semiconductor manufacturing processes, the industry value chain, and key packaging materials, along with answers to frequently asked questions.
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- 2026-03-30Bag-in-Box Containers: A Sustainable Solution for Efficient Liquid Packaging
- Bag-in-Box (BIB) is a packaging solution for storing and transporting liquids.
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- 2026-03-30Clean Containers for High‑Purity Chemicals: Ideal for Storage and Transport
- Storage and transport of critical chemicals for semiconductor and electronics manufacturing.
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- 2025-10-29Experience the future in a new exhibition space
- At the Sekisui Chemical Minase Innovation Center, we have renovated our exhibition area to provide a clearer understanding of our business and latest initiatives.
# MIC # innovation # Mobility # Sekisui Chemical # Electronics # Sensor # industrial # tactilesensor
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- 2025-09-30Metal-plated particles with uniform particle size distribution
- Metal-plated Micropearl™ can be used for conduction between electronic devices and substrate, thermal conduction, gap formation, and others.
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- 2025-09-30Plastic particles with uniform particle size distribution
- They can be used in a variety of applications including gap formation in automobile parts and optical components.
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- 2025-09-30Next-generation display
- Continuously evolving display with higher image quality and performance Sekisui Chemical Electronics materials will contribute to solving issues that arise with this evolution