Category
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- 2026-09-25What Is IPX? SEKISUI Technologies for Achieving Waterproof Performance
- While IPX ratings indicate the waterproof performance of a finished product, material selection is also critical to achieving that performance. This article introduces the basics of IPX ratings and SEKISUI's foam materials, foam tapes, and adhesives that contribute to waterproof design.
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- 2026-09-10What Is Impact Resistance? Sekisui Technologies Supporting Electronic Devices
- An overview of the fundamentals of impact resistance required for electronic devices and the methods used to evaluate it. We also introduce products that leverage Sekisui's impact absorption technologies.
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- 2026-05-08Selection Guide for “Microparticles” to Achieve Precise Gap Control and Stress Relief
- A key material to solve design challenges in semiconductor packaging, electronic material bonding/adhesion, and adhesive coatings
# Electronics
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- 2026-04-07Why Is Debonding Important in Advanced Manufacturing Processes?
- What is debonding? Why is TBDB so critical in advanced manufacturing processes?
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- 2026-04-07A Complete Guide to Semiconductor Manufacturing Processes and Principles
- This article explains the sequence of semiconductor manufacturing processes, the industry value chain, and key packaging materials, along with answers to frequently asked questions.
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- 2026-03-30Bag-in-Box Containers: A Sustainable Solution for Efficient Liquid Packaging
- Bag-in-Box (BIB) is a packaging solution for storing and transporting liquids.
# Electronics
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- 2026-03-30Clean Containers for High‑Purity Chemicals: Ideal for Storage and Transport
- Storage and transport of critical chemicals for semiconductor and electronics manufacturing.
# Electronics
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- 2025-09-30Metal-plated particles with uniform particle size distribution
- Metal-plated Micropearl™ can be used for conduction between electronic devices and substrate, thermal conduction, gap formation, and others.
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- 2025-09-30Plastic particles with uniform particle size distribution
- They can be used in a variety of applications including gap formation in automobile parts and optical components.
