SELFA - high adhesion easy removable UV tape -

Sustainablity

Mobility

Tape

UV irradiated release tape specializing in heat resistance, chemical resistance, and easy peeling

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SELFA - high adhesion easy removable UV tape -

-Challenge- 　Prevention of damage to semiconductor wafers

When manufacturing semiconductor wafers, the wafers must be firmly fixed during the polishing process, and this process poses a risk of damaging the expensive wafers when removing the holding materials.

-Solution-　UV irradiated release tape with high adhesion and easy release

The SELFA series is a removable UV tape that achieves strong adhesion and easy peeling. Gas is generated between the tape and the adhered by UV irradiation, and the tape can be easily removed with no adhesion, making it possible to process thinly polished wafers without damage. We will propose the optimal grade from a wide lineup such as single-sided SELFA HS with high-heat resistance, SELFA HW heat-resistant temporary bonding materials, and SELFA MP with excellent chemical resistance.

-Technology-　Technical information

Technical overview

　 Heat resistivity

Heat resistance of 220°C × 2hours is guaranteed.
Excellent low-residue properties.
Proven record of use in reflow, annealing,
sputtering, CVD, and other heat processes.

　Chemical resistivity

Adaptability to a wide variety of chemicals
Electroless plating, roughening,
resist exposure/development, chemical cleaning, etc.

　Gas debonding

Sekisui's proprietary "gas debonding" technology
realizes easy peeling from adherends.
We have a track record of peeling from sensitive
substrates such as glass and wafers.

　Easy-handling

Easy to handle, tape-type solution
Process construction is possible with
general-purpose and inexpensive manufacturing equipment.

Technology details

　Heat resistivityThe heat resistance is 220°C×2hours or 260°C×5minutes,
with the aim of further improving heat resistance.

No residue, even when processing at high temperatures

　Chemical resistivityAdaptability to a wide variety of chemicals.

Item	Solvent	Temperature(°C)	Process time (sec)	Weight loss (wt%)
1	Tetra Hydro Furfuryl Alcohol 75-100%	60	420	≤１
2	NMP	50	3000	≤１
3	KOH 1%	25	90	≤１
4	CuSO4 18%		4200	≤１
5	H2SO4 5-10%		4200	≤１
6	HCI 6%		4200	≤１
7	Acetic Acid 10%		60	≤１
8	HF 0.5%		900	≤１
9	NH4OH 30%		900	≤１
10	PGME		900	≤１
11	PGMEA		900	≤１
12	TMAH 2.38%		7200	≤１
13	IPA		900	≤１
14	C6H8O7 5%		900	≤１
15	H2O2 30%		900	≤１
16	KOH 5%		900	≤１
17	DMSO		900	≤１

　Gas debondingUnique gas generation technology enables debonding with less stress.

UV reaction of SELFA

　Easy-handling

Applicable to adherends with special
surface geometries.
(e.g. MEMS, ubump, Taiko™ wafer, etc.)
Simple process control enables
good TTV performance.
The simplicity of the manufacturing process
makes it more cost-effective than other
temporary bonding technologies
(e.g. laser debond).

Wafer TTV after BG