1-Part Heat-Curable Grease (Under development)
Sustainablity
Mobility
-Challenge- Measures against high temperatures in the mounting process
When mounting semiconductor chips, it is sometimes difficult to achieve the ideal combination when the environment does not allow for both heat release and adhesion properties to be maintained.
Products with both high-heat resistance and heat release properties can overcome many technical challenges.
-Solution- High heat dissipation paste with high heat resistance and adhesion
1-Part Heat-Curable Grease is a flexible and silicone-free thermal conductive paste that can be molded without voids by coating on heat-generated devices and curing in an oven. Also, because it is a type that radiates heat into the air, it can easily release the heat of the devices. It is a solvent-free type paste which can be applied to flexible printed circuits with minimum 20 μm bond line thickness (BLT), and can achieve ultra-low-heat resistance, making design more flexible. It can also be used as a thermal conductive adhesive because of its adhesion properties.
-Technology- Technical information
Technical overview
High thermal conductivity
Thermal conductivity : Max. 6.0 W/mK
Contributes to heat dispersion inelectric compornents and automotive parts.
High adhesive strength
Adhesive strength(Al/Al) : Max. 8.0 MPa
Achieved both heat dissipation and adhesion.
Low temp. heat curing
Heat curing temperature : More than 85°C
Reduced thermal degradation ofperipheral components.
Low storage modulus
Storage modulus : 300MPa
Improved operability due to low modulus.
Technical details
High thermal conductivity
| Product | Low temp. heat curing | High thermal conductivity |
Test method |
|---|---|---|---|
| Thermal conductivity | 1.8 W/mK | 6.0 W/mK | Nano flash |
High adhesive strength
| Product | Low temp. heat curing | High thermal conductivity |
Test method |
|---|---|---|---|
| Adhesive strength (Al/Al) |
1.8 MPa | 3.0 MPa | Tensile tester |
Low temperature heat curing
| Product | Low temp. heat curing | High thermal conductivity |
Test method |
|---|---|---|---|
| Adhesive strength (Al/Al) |
85°C, 2hrs | 150°C, 2hrs | Oven |
Low storage modulus
| Product | Low temp. heat curing | High thermal conductivity |
Test method |
|---|---|---|---|
| Storage modulus | 300 MPa | 300 MPa | DMA |
Document download
認定証ダウンロードファイル一覧
| Name | Type | File | Update | File |
|---|---|---|---|---|
|
Catalog:1-Part Heat-Curable Grease_SekisuiMobilitySolution |
Catalog |
2023-09-11 |
Download
1.16 MB
|
