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Easy peeling
Automation
Shorter processes
Low contamination
- For cost
reduction -
Easy peeling
Improved yield rates
Reduced waste
performance
Durability
Impact resistance
Chemical resistance
Heat resistance
environment
CO2 reduction
Reduced waste
Low VOC
For improved processes
Easy peeling
Peeling capability without leaving any adhesive residues while maintaining strong adhesion
We have products capable of responding to your needs such as in the following situations:
- You just want to remove the tape and remake products when an abnormality is found in a product inspection
- You want to easily remove the tape after protecting devices in a heating process, such as a reflow process, during the manufacture of various packages
- You want to easily remove the tape after secure bonding or fixing during the grinding process
- You want to disassemble LCD and OLED panels without scratching the panel surface during repair
Easy-to-Dismantle/Easy-to-Remove Foam Tape
A reusable flexible foam tape that combines strong holding power with reworkability
Protective Tape for Optical Films 67/68/6900 Series
A high-performance protective tape that minimizes substrate contamination and prevents the beauty of optical films
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Double-sided Tape for Fixing Polishing Pads
A double-faced tape with a differential design that provides excellent adhesion and easy removability
Waterproof/Shock-Absorbing Foam Tape 5200 Series
A heat-resistant foam tape that delivers both waterproofing and shock absorption
High-Heat-Resistance Temporary Fixing UV Tape SELFA™ Series
A high-heat-resistance, high-adhesion temporary fixing tape enabling easy removal through UV irradiation
Double-faced adhesive tape 3800 series for fixing LCD components
Double-sided tape for fixing LCD parts
Automation
Development of production lines free from human errors
We have products that enable you to solve such problems as the following:
- Fostering skilled workers
- Formulating measures against human errors
- Improving microfabrication technology
- Remotely checking production lines
- Unstable communication even with the 5G environment in place
- Planning cost reduction due to rising labor costs
5G/6G Radio Wave Reflective Film
Transparent, thin, and flexible film for efficient diffuse reflection of a wide range of radio waves
UV + Moisture-Curing Flexible Adhesive Photolec™ B
A flexible adhesive that follows fine-line patterns and curved surfaces, expanding design flexibility.
High Thermal Conductivity Heat Dissipation Sheet MANION™ Series
An ultra-high-thermal-conductivity carbon heat dissipation sheet created by magnetic field alignment technology
Thermal Grease CGW™ Series
A two-component high-performance thermal grease that combines flexibility with thermal conductivity
Shorter processes
Curing capability with shorter curing time and high efficiency
We have products capable of responding to your needs such as in the following situations:
- You want a material that has high adhesive strength and can cure even at low temperatures
- You want to increase production efficiency by shortening the curing time of a bonding process
- You want to peel products without damaging the wafers or resin substrates and leaving no adhesive residues
- You want to simplify the existing processes
Dot Connector
Connector that integrates both conductive and waterproof functions
Dot Connector (SMT,PSA)
Rubber connector with integrated insulating and conductive parts
Waterproof Dot Connector
Connector that integrates both conductive and waterproof functions
Anisotropic Conductive Paste EPOWELL™CP
Anisotropic conductive adhesive optimized for RFID, enabling low-temperature and short-time mounting
Inkjet Ink for Ultra-Fine and High-Aspect-Ration Patterning
High-viscosity inkjet material that enables both freeform patterning and high resolution
UV + Moisture-Curing Flexible Adhesive Photolec™ B
A flexible adhesive that follows fine-line patterns and curved surfaces, expanding design flexibility.
Fluorine-based Tape for Difficult-to-Bond Surfaces FA/FB Series (Under development)
Primer-free adhesive tape with adhesion to fluorine resin
High-Heat-Resistance Temporary Fixing UV Tape SELFA™ Series
A high-heat-resistance, high-adhesion temporary fixing tape enabling easy removal through UV irradiation
UV and Low-Temperature Curing, Low-Moisture Permeable Adhesive Photolec™ E
A low-moisture-permeability UV-curable adhesive that bonds light-shielding substrates at low temperatures in a short time.
UV Instant-Curing Highly Transparent/ Black Adhesive Photolec™ A
A UV adhesive that combines light-shielding capability with strong adhesion
Low contamination
Stable production processes with no organic contamination and elution of impurities
We have products that enable you to solve such problems as the following:
- Increase in defect rates due to the effect of outgas generated during the heating process
- Particles entering during the semiconductor manufacturing process
- Organic contamination during the panel manufacturing process
- Maintaining quality during the storage of high-purity chemical solutions
- Foreign matter, adhesive residues, etc. during the manufacture of FPCs and PCBs
Release Film for Heat Press Process
Multi-layer release film for hot pressing that ensures clean release even under high temperatures
![[フォトマスク用保護フィルム タックウェル™] の製品画像（準備中）](/files/electronics/image/NO IMAGE.png)
Protection Film for Photomasks TACWELL™
Highly durable protection film that prevents release layer peeling
Solder Resist Making Tape
A thin-film masking tape that combines strong adhesion with easy peelability
Clean bottle
High-cleanliness bottle for high-purity chemicals and medical applications
UV and Low-Temperature Curing, Low-Moisture Permeable Adhesive Photolec™ E
A low-moisture-permeability UV-curable adhesive that bonds light-shielding substrates at low temperatures in a short time.
For cost reduction
Easy peeling
Reduction of labor costs in the manufacturing process
We have products capable of responding to your needs such as in the following situations:
- You just want to remove the tape and remake products when an abnormality is found in a product inspection
- You want to easily remove the tape after protecting devices in a heating process, such as a reflow process, during the manufacture of various packages
- You want to easily remove the tape after secure bonding or fixing during the grinding process
- You want to disassemble LCD and OLED panels without scratching the panel surface during repair
Easy-to-Dismantle/Easy-to-Remove Foam Tape
A reusable flexible foam tape that combines strong holding power with reworkability
Protective Tape for Optical Films 67/68/6900 Series
A high-performance protective tape that minimizes substrate contamination and prevents the beauty of optical films
Double-sided Tape for Fixing Polishing Pads
A double-faced tape with a differential design that provides excellent adhesion and easy removability
Waterproof/Shock-Absorbing Foam Tape 5200 Series
A heat-resistant foam tape that delivers both waterproofing and shock absorption
High-Heat-Resistance Temporary Fixing UV Tape SELFA™ Series
A high-heat-resistance, high-adhesion temporary fixing tape enabling easy removal through UV irradiation
Double-faced adhesive tape 3800 series for fixing LCD components
Double-sided tape for fixing LCD parts
Improved yield rates
Materials free from in-process reworking with less material loss
We have products that enable you to solve such problems as the following:
- Residues from the peeling off of protective tape during the semiconductor manufacturing process
- Followability and embedding properties of protective materials during FPC production
- Damage to printed circuit boards during the removal of process materials due to insufficient release properties
- Wrinkles and cracks on foldable smartphones
Protective Tape for Optical Films 67/68/6900 Series
A high-performance protective tape that minimizes substrate contamination and prevents the beauty of optical films
Impact-Resistant and Highly Transparent Resin for UTG Photolec™
Highly durable protection film that prevents release layer peeling
Clean bottle
High-cleanliness bottle for high-purity chemicals and medical applications
High-Heat-Resistance Temporary Fixing UV Tape SELFA™ Series
A high-heat-resistance, high-adhesion temporary fixing tape enabling easy removal through UV irradiation
Reduced waste
Waste reduction in the production process due to the efficient use of materials
We contribute to reducing process waste in the following ways:
- Switching to an adhesive to reduce waste
- Standardizing process materials, such as adhesives and pressure-sensitive adhesives, to cut down on material loss
- Switching to materials with excellent reworkability to reduce the number of various parts
- Changing storage containers to produce less raw material residues
Easy-to-Dismantle/Easy-to-Remove Foam Tape
A reusable flexible foam tape that combines strong holding power with reworkability
Impact-Resistant and Highly Transparent Resin for UTG Photolec™
Highly durable protection film that prevents release layer peeling
Inkjet Ink for Ultra-Fine and High-Aspect-Ration Patterning
High-viscosity inkjet material that enables both freeform patterning and high resolution
Clean bottle
High-cleanliness bottle for high-purity chemicals and medical applications
UV + Heat-Curing Low-Contamination Adhesive Photolec™ S
A sealing material ideal for LCD panels, combining narrow-bezel compatibility with non-contaminating properties
UV + Moisture-Curing Flexible Adhesive Photolec™ B
A flexible adhesive that follows fine-line patterns and curved surfaces, expanding design flexibility.
High-Heat-Resistance Temporary Fixing UV Tape SELFA™ Series
A high-heat-resistance, high-adhesion temporary fixing tape enabling easy removal through UV irradiation
UV and Low-Temperature Curing, Low-Moisture Permeable Adhesive Photolec™ E
A low-moisture-permeability UV-curable adhesive that bonds light-shielding substrates at low temperatures in a short time.
UV Instant-Curing Highly Transparent/ Black Adhesive Photolec™ A
A UV adhesive that combines light-shielding capability with strong adhesion
For improved performance
Durability
Realization of robust quality and long-life design
We offer materials capable of realizing durability in next-generation technologies, including
- Protective materials that improve the final physical properties of cutting-edge foldable smartphones
- PVB capable of simultaneously achieving the three binder properties: toughness, adhesion, and dispersibility
- Low-Df and Low-Dk interlayer insulation materials adaptable to the evolution of semiconductor package substrates
- Heat dissipation materials that improve the durability of final products by achieving flexibility as well as adhesion
- Protective materials that improve the surface condition of solder resist (SR)
Impact-Resistant and Highly Transparent Resin for UTG Photolec™
Highly durable protection film that prevents release layer peeling
Dot Connector
Connector that integrates both conductive and waterproof functions
Dot Connector (SMT,PSA)
Rubber connector with integrated insulating and conductive parts
Waterproof Dot Connector
Connector that integrates both conductive and waterproof functions
Solder Resist Making Tape
A thin-film masking tape that combines strong adhesion with easy peelability
Thermosetting Interlayer Insulating Film
Build-up film that contributes to finer wiring and high-speed communication in electronic devices.
UV and Low-Temperature Curing, Low-Moisture Permeable Adhesive Photolec™ E
A low-moisture-permeability UV-curable adhesive that bonds light-shielding substrates at low temperatures in a short time.
UV Instant-Curing Highly Transparent/ Black Adhesive Photolec™ A
A UV adhesive that combines light-shielding capability with strong adhesion
High Thermal Conductivity Heat Dissipation Sheet MANION™ Series
An ultra-high-thermal-conductivity carbon heat dissipation sheet created by magnetic field alignment technology
Thermal Grease CGW™ Series
A two-component high-performance thermal grease that combines flexibility with thermal conductivity
Powder Resin for Binder Applications S-LEC™ B,K
A versatile binder resin that combines adhesion, dispersibility, and toughness
Impact resistance
Highly functional products resistant to drops, vibrations, and shocks
We offer impact-resistant materials for such situations as the following:
- Protecting devices, such as digital signage and large TVs, from transportation impact
- Protecting small devices, including smartphones, wearables, and AR and VR devices, from everyday drops and shocks
- Protecting semiconductor package boards, FPCs, optical parts, and other delicate components from shock during manufacturing
Easy-to-Dismantle/Easy-to-Remove Foam Tape
A reusable flexible foam tape that combines strong holding power with reworkability
EXAGEL
Pantel GEL
Transparent gel material with excellent flexibility and shock absorption
Impact-Resistant and Highly Transparent Resin for UTG Photolec™
Highly durable protection film that prevents release layer peeling
Dot Connector
Connector that integrates both conductive and waterproof functions
Dot Connector (SMT,PSA)
Rubber connector with integrated insulating and conductive parts
Waterproof Dot Connector
Connector that integrates both conductive and waterproof functions
Thermosetting Interlayer Insulating Film
Build-up film that contributes to finer wiring and high-speed communication in electronic devices.
Clean bottle
High-cleanliness bottle for high-purity chemicals and medical applications
Waterproof/Shock-Absorbing Foam Tape 5200 Series
A heat-resistant foam tape that delivers both waterproofing and shock absorption
UV + Moisture-Curing Flexible Adhesive Photolec™ B
A flexible adhesive that follows fine-line patterns and curved surfaces, expanding design flexibility.
Heat Dissipation Sheet TIMLIGHT™ Series
A multifunctional heat dissipation sheet that combines flexibility to conform to uneven surfaces and high thermal conductivity
Closed-cell form XLIM™
Next-generation device foam that absorbs impact, even at a thickness of just 0.06 mm
Chemical resistance
Reassuring, highly functional materials that are resistant to oils, acids, and chemicals
We can offer chemical-resistant materials that are the most suitable for your needs, through such properties as
- Withstanding etching, polishing, and chemical treatment processes
- Being suitable for use in mixing with solvents
- Protecting products that people touch on a daily basis, including electronic devices and wearables, from sweat, disinfectants, sunscreen cream, etc
High-Performance Metal Plated Filler Micropearl™
High-performance functional filler that combines flexibility and conductivity without causing damage
Clean bottle
High-cleanliness bottle for high-purity chemicals and medical applications
Double-sided Tape for Fixing Polishing Pads
A double-faced tape with a differential design that provides excellent adhesion and easy removability
UV + Moisture-Curing Flexible Adhesive Photolec™ B
A flexible adhesive that follows fine-line patterns and curved surfaces, expanding design flexibility.
Fluorine-based Tape for Difficult-to-Bond Surfaces FA/FB Series (Under development)
Primer-free adhesive tape with adhesion to fluorine resin
Plastic-Based High-Performance Filler Micropearl™
High-performance fine particles that meet the needs of next-generation devices with precise thickness control and stress relaxation
High-Heat-Resistance Temporary Fixing UV Tape SELFA™ Series
A high-heat-resistance, high-adhesion temporary fixing tape enabling easy removal through UV irradiation
UV Instant-Curing Highly Transparent/ Black Adhesive Photolec™ A
A UV adhesive that combines light-shielding capability with strong adhesion
Heat resistance
Highly reliable materials capable of withstanding reflow processes and long-duration heating
We offer materials that have the thermal durability required to achieve the following:
- Device protection during thermal processes, such as reflow during the production of various packages
- Absence of discoloration in high-heat environments for long periods of time
- mprovement of curing efficiency by making effective use of heat
- Thermal management of areas with high heat generation by using thermal conductivity
High-Heat-Resistance Temporary Fixing UV Tape SELFA™ Series
A high-heat-resistance, high-adhesion temporary fixing tape enabling easy removal through UV irradiation
UV Instant-Curing Highly Transparent/ Black Adhesive Photolec™ A
A UV adhesive that combines light-shielding capability with strong adhesion
Adhesive with Precision Gap Control Particles EPOWELL™ GP
High Thermal Conductivity Heat Dissipation Sheet MANION™ Series
An ultra-high-thermal-conductivity carbon heat dissipation sheet created by magnetic field alignment technology
Thermal Grease CGW™ Series
A two-component high-performance thermal grease that combines flexibility with thermal conductivity
Powder Resin for Binder Applications S-LEC™ B,K
A versatile binder resin that combines adhesion, dispersibility, and toughness
For a better environment
CO2 reduction
Highly functional chemical materials that are renewable with low energy consumption
We offer products that contribute to GHG reduction, including
- Bio-based tapes capable of achieving the same performance as that of conventional petroleum-based products
- Kraft tapes that significantly reduce waste volume
- Moisture-curing elastic adhesives that are solvent-free and do not require heating
- Heat dissipation materials that enable heat management without wasting energy
Silicone Free Thermal conductive Grease GA Series
Thermosetting Interlayer Insulating Film
Build-up film that contributes to finer wiring and high-speed communication in electronic devices.
UV + Moisture-Curing Flexible Adhesive Photolec™ B
A flexible adhesive that follows fine-line patterns and curved surfaces, expanding design flexibility.
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Eco-Friendly Adhesive Tape Bio Tape
A plant-based sustainable tape that maintains high adhesion and strong holding power
High Thermal Conductivity Heat Dissipation Sheet MANION™ Series
An ultra-high-thermal-conductivity carbon heat dissipation sheet created by magnetic field alignment technology
Thermal Grease CGW™ Series
A two-component high-performance thermal grease that combines flexibility with thermal conductivity
Heat Dissipation Sheet TIMLIGHT™ Series
A multifunctional heat dissipation sheet that combines flexibility to conform to uneven surfaces and high thermal conductivity
Reduced waste
Waste reduction in the production process due to the efficient use of materials
We contribute to reducing process waste in the following ways:
- Switching to an adhesive to reduce waste
- Standardizing process materials, such as adhesives and pressure-sensitive adhesives, to cut down on material loss
- Switching to materials with excellent reworkability to reduce the number of various parts
- Changing storage containers to produce less raw material residues
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Easy-to-Dismantle/Easy-to-Remove Foam Tape
A reusable flexible foam tape that combines strong holding power with reworkability
Impact-Resistant and Highly Transparent Resin for UTG Photolec™
Highly durable protection film that prevents release layer peeling
Inkjet Ink for Ultra-Fine and High-Aspect-Ration Patterning
High-viscosity inkjet material that enables both freeform patterning and high resolution
Clean bottle
High-cleanliness bottle for high-purity chemicals and medical applications
UV + Heat-Curing Low-Contamination Adhesive Photolec™ S
A sealing material ideal for LCD panels, combining narrow-bezel compatibility with non-contaminating properties
UV + Moisture-Curing Flexible Adhesive Photolec™ B
A flexible adhesive that follows fine-line patterns and curved surfaces, expanding design flexibility.
UV and Low-Temperature Curing, Low-Moisture Permeable Adhesive Photolec™ E
A low-moisture-permeability UV-curable adhesive that bonds light-shielding substrates at low temperatures in a short time.
UV Instant-Curing Highly Transparent/ Black Adhesive Photolec™ A
A UV adhesive that combines light-shielding capability with strong adhesion
Low VOC
Products capable of realizing two characteristics: “highly functional chemical products” and “low-hazard substances”
We offer products and services that give consideration to the environment and the human body, such as
- Adhesive products that eliminate health concerns, including odors generated on production lines
- Low-VOC (volatile organic compound) tapes and low-VOC adhesives
- Consultation regarding the use of various chemical materials
Protective Tape for Optical Films 67/68/6900 Series
A high-performance protective tape that minimizes substrate contamination and prevents the beauty of optical films
Protection Film for Photomasks TACWELL™
Highly durable protection film that prevents release layer peeling
Solder Resist Making Tape
A thin-film masking tape that combines strong adhesion with easy peelability
Double-sided Tape for Fixing Polishing Pads
A double-faced tape with a differential design that provides excellent adhesion and easy removability
Waterproof/Shock-Absorbing Foam Tape 5200 Series
A heat-resistant foam tape that delivers both waterproofing and shock absorption
UV + Heat-Curing Low-Contamination Adhesive Photolec™ S
A sealing material ideal for LCD panels, combining narrow-bezel compatibility with non-contaminating properties
UV + Moisture-Curing Flexible Adhesive Photolec™ B
A flexible adhesive that follows fine-line patterns and curved surfaces, expanding design flexibility.
Fluorine-based Tape for Difficult-to-Bond Surfaces FA/FB Series (Under development)
Primer-free adhesive tape with adhesion to fluorine resin
High-Heat-Resistance Temporary Fixing UV Tape SELFA™ Series
A high-heat-resistance, high-adhesion temporary fixing tape enabling easy removal through UV irradiation
UV and Low-Temperature Curing, Low-Moisture Permeable Adhesive Photolec™ E
A low-moisture-permeability UV-curable adhesive that bonds light-shielding substrates at low temperatures in a short time.
UV Instant-Curing Highly Transparent/ Black Adhesive Photolec™ A
A UV adhesive that combines light-shielding capability with strong adhesion
Double-faced adhesive tape 3800 series for fixing LCD components
Double-sided tape for fixing LCD parts
Conductive Adhesive Tape 7800 Series
A strong-adhesion tape for reflow processes that combines high conductivity with heat resistance