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Peeling capability without leaving any adhesive residues while maintaining strong adhesion

We have products capable of responding to your needs such as in the following situations:

• You just want to remove the tape and remake products when an abnormality is found in a product inspection
• You want to easily remove the tape after protecting devices in a heating process, such as a reflow process, during the manufacture of various packages
• You want to easily remove the tape after secure bonding or fixing during the grinding process
• You want to disassemble LCD and OLED panels without scratching the panel surface during repair

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Development of production lines free from human errors

We have products that enable you to solve such problems as the following:

• Fostering skilled workers
• Formulating measures against human errors
• Improving microfabrication technology
• Remotely checking production lines
• Unstable communication even with the 5G environment in place
• Planning cost reduction due to rising labor costs

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Curing capability with shorter curing time and high efficiency

We have products capable of responding to your needs such as in the following situations:

• You want a material that has high adhesive strength and can cure even at low temperatures
• You want to increase production efficiency by shortening the curing time of a bonding process
• You want to peel products without damaging the wafers or resin substrates and leaving no adhesive residues
• You want to simplify the existing processes

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Stable production processes with no organic contamination and elution of impurities

We have products that enable you to solve such problems as the following:

• Increase in defect rates due to the effect of outgas generated during the heating process
• Particles entering during the semiconductor manufacturing process
• Organic contamination during the panel manufacturing process
• Maintaining quality during the storage of high-purity chemical solutions
• Foreign matter, adhesive residues, etc. during the manufacture of FPCs and PCBs

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Reduction of labor costs in the manufacturing process

We have products capable of responding to your needs such as in the following situations:

• You just want to remove the tape and remake products when an abnormality is found in a product inspection
• You want to easily remove the tape after protecting devices in a heating process, such as a reflow process, during the manufacture of various packages
• You want to easily remove the tape after secure bonding or fixing during the grinding process
• You want to disassemble LCD and OLED panels without scratching the panel surface during repair

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Materials free from in-process reworking with less material loss

We have products that enable you to solve such problems as the following:

• Residues from the peeling off of protective tape during the semiconductor manufacturing process
• Followability and embedding properties of protective materials during FPC production
• Damage to printed circuit boards during the removal of process materials due to insufficient release properties
• Wrinkles and cracks on foldable smartphones

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Waste reduction in the production process due to the efficient use of materials

We contribute to reducing process waste in the following ways:

• Switching to an adhesive to reduce waste
• Standardizing process materials, such as adhesives and pressure-sensitive adhesives, to cut down on material loss
• Switching to materials with excellent reworkability to reduce the number of various parts
• Changing storage containers to produce less raw material residues

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Realization of robust quality and long-life design

We offer materials capable of realizing durability in next-generation technologies, including

• Protective materials that improve the final physical properties of cutting-edge foldable smartphones
• PVB capable of simultaneously achieving the three binder properties: toughness, adhesion, and dispersibility
• Low-Df and Low-Dk interlayer insulation materials adaptable to the evolution of semiconductor package substrates
• Heat dissipation materials that improve the durability of final products by achieving flexibility as well as adhesion
• Protective materials that improve the surface condition of solder resist (SR)

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Highly functional products resistant to drops, vibrations, and shocks

We offer impact-resistant materials for such situations as the following:

• Protecting devices, such as digital signage and large TVs, from transportation impact
• Protecting small devices, including smartphones, wearables, and AR and VR devices, from everyday drops and shocks
• Protecting semiconductor package boards, FPCs, optical parts, and other delicate components from shock during manufacturing

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Reassuring, highly functional materials that are resistant to oils, acids, and chemicals

We can offer chemical-resistant materials that are the most suitable for your needs, through such properties as

• Withstanding etching, polishing, and chemical treatment processes
• Being suitable for use in mixing with solvents
• Protecting products that people touch on a daily basis, including electronic devices and wearables, from sweat, disinfectants, sunscreen cream, etc

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Highly reliable materials capable of withstanding reflow processes and long-duration heating

We offer materials that have the thermal durability required to achieve the following:

• Device protection during thermal processes, such as reflow during the production of various packages
• Absence of discoloration in high-heat environments for long periods of time
• mprovement of curing efficiency by making effective use of heat
• Thermal management of areas with high heat generation by using thermal conductivity

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Highly functional chemical materials that are renewable with low energy consumption

We offer products that contribute to GHG reduction, including

• Bio-based tapes capable of achieving the same performance as that of conventional petroleum-based products
• Kraft tapes that significantly reduce waste volume
• Moisture-curing elastic adhesives that are solvent-free and do not require heating
• Heat dissipation materials that enable heat management without wasting energy

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Waste reduction in the production process due to the efficient use of materials

We contribute to reducing process waste in the following ways:

• Switching to an adhesive to reduce waste
• Standardizing process materials, such as adhesives and pressure-sensitive adhesives, to cut down on material loss
• Switching to materials with excellent reworkability to reduce the number of various parts
• Changing storage containers to produce less raw material residues

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Products capable of realizing two characteristics: “highly functional chemical products” and “low-hazard substances”

We offer products and services that give consideration to the environment and the human body, such as

• Adhesive products that eliminate health concerns, including odors generated on production lines
• Low-VOC (volatile organic compound) tapes and low-VOC adhesives
• Consultation regarding the use of various chemical materials

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