Search by Device ｜ Semiconductor- related
Production process flow related to semiconductors
The Electronics Strategy Office is running a wide material portfolio of tape/film/precise particles/sealing material. We are providing high functional products especially for the frontier needs in semiconductor industry, such as Fine L/S, high integrated design, 3D assembly, ultra thin membrane.
Wafer/chip production process
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Protection Tape Lamination
High Adhesion-Easy Removable UV Tape Heat Resistant SELFA™ -
Back Grinding
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Chemical Plating・High Temperture Treat
High Adhesion-Easy Removable UV Tape Heat Resistant SELFA™ -
Dicing Tape
Lamination -
UV Irradiation・Protection Tape Removing
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Chip Completion
Package substrate production process
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Copper Core Manufacture
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Build Up Film
Build Up Film -
Via, Dismear, Plating,
Masking tape for semiconductor package substrates
Solder Resistant Coating. -
Print DAM material
High-viscosity inkjet ink
Inkjet Material -
Package Substrate Completion
1+2Assembly production process
Tape
Solder Resist Making Tape
A thin-film masking tape that combines strong adhesion with easy peelability
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Double-sided Tape for Fixing Polishing Pads
A double-faced tape with a differential design that provides excellent adhesion and easy removability
High-Heat-Resistance Temporary Fixing UV Tape SELFA™ Series
A high-heat-resistance, high-adhesion temporary fixing tape enabling easy removal through UV irradiation
Sheet
Film
Adhesive
Microsphere・Filler
High-Performance Metal Plated Filler Micropearl™
High-performance functional filler that combines flexibility and conductivity without causing damage
Plastic-Based High-Performance Filler Micropearl™
High-performance fine particles that meet the needs of next-generation devices with precise thickness control and stress relaxation
