Search by Device ｜ Electronic components・ Substrate
- Microsphere
[Micropearl™]Microsphere
- [Micropearl™]
- Plastic particles with uniform particle size distribution. High-performance filler combines properties such as stability, flexibility, and resilience. Can be used as in-plane spacers, stress relaxation materials, and unevenness-forming materials.
Application
- GAP control adhesive containing uniform particles
GAP control adhesive containing uniform particles
- Thermosetting adhesive containing ultra high precision spacer particles. The thickness of the adhesive can be precisely controlled.
Application
- Anisotropic conductive adhesive
Anisotropic conductive adhesive
- Solder Anisotropic Conductive Paste | Anisotropic Conductive Paste For RFID
Application
- Conductive Tape
[7800 series]Conductive Tape
- [7800 series]
- Adhesive tape with excellent conductivity, heat dissipation, adhesive strength, bending resistance, and thinness. Suitable for grounding/shielding/heat dissipation of electronic devices.
Application
- Removable UV Tape
[SELFA™ Series]Removable UV Tape
- [SELFA™ Series]
- Features：Shock Resistant / Reducing the number of parts / Low Transmission Loss
Application
- Photo mask protection film
[TACKWELL™]Photo mask protection film
- [TACKWELL™]
- Highly durable, chemical-resistant tape with excellent optical properties produced in a clean environment, suitable as protective tape for photomasks used in PCB production.
Application
- Heat Release Related Series
Heat Release Related Series
- Heat Release Related Products
- Silicone - Non silicone, Sheet / Pods / Paste / Grease, etc. unique line up for TIMs
Application
- Pattern formation of exterior peripheries/Usage for package miniaturization [High-viscosity inkjet ink]
Pattern formation of exterior peripheries/Usage for package miniaturization
- [High-viscosity inkjet ink]
- Optimizing printing processes with our one-stop development.
Application
- Release Film for Heat Press Process
[Low Outgas Release Film]Release Film for Heat Press Process
- [Low Outgas Release Film]
- Release film exhibiting excellent heat resistance, flexibility, and low-contamination properties. Suitable for surface protection and buffering in heat press processes for manufacturing FPCs, semiconductor molds, next-generation displays etc.
Application
- Interlayer Insulating Film for Making Build-up Boards [Heat-curing Build Up Film NX/NQ]
Interlayer Insulating Film for Making Build-up Boards
- [Heat-curing Build Up Film NX/NQ]
- Low transmission loss, high insulation reliability.
Application
- Polyvinyl Acetal Resin
[S-LEC™ Series]Polyvinyl Acetal Resin
- [S-LEC™ Series]
- Tough, high flexibility, high adhesiveness, crosslinkability, compatibility. Easy to dissolve in various solvents including alcohol.
Application
- Compression Type Conductive Connector
[Dot Connector Series]Compression Type Conductive Connector
- [Dot Connector Series]
- Electrical Connection, Holder Integrated Connector | Rubber Connector for Electrical Connection and Grounding (Adhesive Fixing) | Rubber Connector for Electrical Connection and Grounding (Solder Mounting) | Electrical Connection, Flexible Rubber Connector
Application
- Sheet Products
[POLYELEC™ Series]Sheet Products
- [POLYELEC™ Series]
- Excellent basic properties of polyolefin materials, as well as sheet materials for the electronics field, which have added functionality through proprietary blending technologies.
Application
- Clean containers for semiconductor chemicals
Clean containers for semiconductor chemicals
- SEKISUI's clean containers are available from R&D usage to mass production usage. All products are made from the same clean raw materials, and the dissolution of components into the contents is minimized. We also offer a wide range of sizes from small (100mL) to large (200L), and can provide UN standard compliant products.
Application
Tape
![[フォトマスク用保護フィルム タックウェル™] の製品画像（準備中）](/files/electronics/image/NO IMAGE.png)
Protection Film for Photomasks TACWELL™
Highly durable protection film that prevents release layer peeling
SELFA™ - high adhesion easy removable UV tape -
Conductive tape 7800 series
Conductive tape
Sheet
Functional Insulting Sheet POLYELEC™
High Thermal Conductivity Heat Dissipation Sheet MANION™ Series
Heat Dissipation Sheet TIMLIGHT™ Series
Insulated High Thermal-conductive, low siloxane silicone heat release sheet
Film
Release Film for Heat Press Process
Multi-layer release film for hot pressing that ensures clean release even under high temperatures
Thermosetting Interlayer Insulating Film
Build-up film that contributes to finer wiring and high-speed communication in electronic devices.
Adhesive
Adhesive with Precision Gap Control Particles EPOWELL™CP
Anisotropic conductive adhesive optimized for RFID, enabling low-temperature and short-time mounting
Functional fine particles - Epowell GP series -
Microsphere・Filler
High-Performance Metal Plated Filler Micropearl™
High-performance functional filler that combines flexibility and conductivity without causing damage
Functional fine particles - Micropearl™ Series -
Grease
Resin
Paste Resin S-LEC™ SV
Polyvinyl Acetal Resin S-LEC B / S-LEC K
Polyvinyl acetal resin (PVB) with excellent physical properties : Toughness, Adhesiveness and Dispersibility
Ink
Molded Product
Dot Connector
Connector that integrates both conductive and waterproof functions
Dot Connector (SMT,PSA)
Rubber connector with integrated insulating and conductive parts
Waterproof Dot Connector
Connector that integrates both conductive and waterproof functions
