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- Microsphere
[Micropearl™]Microsphere
- [Micropearl™]
- Plastic particles with uniform particle size distribution. High-performance filler combines properties such as stability, flexibility, and resilience. Can be used as in-plane spacers, stress relaxation materials, and unevenness-forming materials.
Application
- Adhesive Products
[Photolec™ Series]Adhesive Products
- [Photolec™ Series]
- Sealant for ODF | UV-curing adhesives | UV delayed curing Low moisture permeable adhesive | UV (B stage) + Moisture Curing Adhesive | LED encapsulation material & UTG protective resin | GAP control adhesive containing uniform particles
Application
- Pattern formation of exterior peripheries/Usage for package miniaturization [High-viscosity inkjet ink]
Pattern formation of exterior peripheries/Usage for package miniaturization
- [High-viscosity inkjet ink]
- Optimizing printing processes with our one-stop development.
Application
- Heat Release Related Series
Heat Release Related Series
- Heat Release Related Products
- Silicone - Non silicone, Sheet / Pods / Paste / Grease, etc. unique line up for TIMs
Application
- Waterproof and Moisture-proof Sealing Applications [PantelGEL]
Waterproof and Moisture-proof Sealing Applications
- [PantelGEL]
- Low-hardness, high-strength silicone GEL material with excellent waterproof, dustproof and cushioning properties. Insert molding with regular resin, metal, and film is possible.
Application
Sheet
High Thermal Conductivity Heat Dissipation Sheet MANION™ Series
An ultra-high-thermal-conductivity carbon heat dissipation sheet created by magnetic field alignment technology
Heat Dissipation Sheet TIMLIGHT™ Series
A multifunctional heat dissipation sheet that combines flexibility to conform to uneven surfaces and high thermal conductivity
Adhesive
UV + Heat-Curing Low-Contamination Adhesive Photolec™ S
A sealing material ideal for LCD panels, combining narrow-bezel compatibility with non-contaminating properties
UV + Moisture-Curing Flexible Adhesive Photolec™ B
A flexible adhesive that follows fine-line patterns and curved surfaces, expanding design flexibility.
UV and Low-Temperature Curing, Low-Moisture Permeable Adhesive Photolec™ E
A low-moisture-permeability UV-curable adhesive that bonds light-shielding substrates at low temperatures in a short time.
UV Instant-Curing Highly Transparent/ Black Adhesive Photolec™ A
A UV adhesive that combines light-shielding capability with strong adhesion
Microsphere・Filler
High-Performance Metal Plated Filler Micropearl™
High-performance functional filler that combines flexibility and conductivity without causing damage
Plastic-Based High-Performance Filler Micropearl™
High-performance fine particles that meet the needs of next-generation devices with precise thickness control and stress relaxation
Grease
Silicone Free Thermal conductive Grease GA Series
Thermal Grease CGW™ Series
A two-component high-performance thermal grease that combines flexibility with thermal conductivity