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- Metal-plated Micropearl™
Metal-plated Micropearl™
- By adding different metal coatings to plastic particles that are the same size, they can work as strong conductive fillers. Our unique manufacturing technology also allows for hardness control. They also act as unique, high-performance lightweight fillers. They have low specific gravity, high dispersion, low resistance, and high flexibility.
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED
- Adhesive Products
[Photolec™ Series]Adhesive Products
- [Photolec™ Series]
- Sealant for ODF | UV-curing adhesives | UV delayed curing Low moisture permeable adhesive | UV (B stage) + Moisture Curing Adhesive | LED encapsulation material & UTG protective resin | GAP control adhesive containing uniform particles
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED
- LED encapsulation material & UTG protective resin
[Photolec™ New]LED encapsulation material & UTG protective resin
- [Photolec™ New]
- UV-curable μLED chip protection resin with inkjet applicability & Greatly improves pen drop resistance simply by coating.
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED
- Functional Foam Tape
[5200 Series]Functional Foam Tape
- [5200 Series]
- Combination of foam and adhesive with excellent stress relaxation. High impact resistance, high step followability (waterproof, dustproof), high adhesive reliability.
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED
- Conductive Tape
[7800 series]Conductive Tape
- [7800 series]
- Adhesive tape with excellent conductivity, heat dissipation, adhesive strength, bending resistance, and thinness. Suitable for grounding/shielding/heat dissipation of electronic devices.
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED
- Waterproof, Anti-vibration, Shock Absorbing Thin Foam [XLIM™]
Waterproof, Anti-vibration, Shock Absorbing Thin Foam
- 【XLIM™】
- Ultra-thin, high-performance foam that combines high sealing properties and high shock absorption.
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED
- Heat Release Related Series
Heat Release Related Series
- Heat Release Related Products
- Silicone - Non silicone, Sheet / Pods / Paste / Grease, etc. unique line up for TIMs
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED
- Compression Type Conductive Connector
[Dot Connector Series]Compression Type Conductive Connector
- [Dot Connector Series]
- Electrical Connection, Holder Integrated Connector | Rubber Connector for Electrical Connection and Grounding (Adhesive Fixing) | Rubber Connector for Electrical Connection and Grounding (Solder Mounting) | Electrical Connection, Flexible Rubber Connector
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED
- Wearable(xR)Practical Examples Some product information.Click here.
Practical Examples
- XLIM™ / Foam Tape
/Heat Release Related Series
The high-quality features of each product are presented.
Some product information.Click here.
- XLIM™ / Foam Tape
- DEVICE
-
Semiconductor-
relatedSemiconductor-related
Electronic
components・
SubstrateElectronic components・Substrate
LCD・
Touch PanelLCD・Touch Panel
OLED・
mini/μLEDOLED・mini/μLED
Tape
Sheet

High Thermal Conductivity Heat Dissipation Sheet MANION™ Series

Heat Dissipation Sheet TIMLIGHT™ Series
Insulated High Thermal-conductive, low siloxane silicone heat release sheet
Foam

Heat resistant foam tape 5200series

Closed-cell form XLIM™
Next-generation device foam that absorbs impact, even at a thickness of just 0.06 mm
Adhesive

Impact-Resistant and Highly Transparent Resin for UTG Photolec™
Highly durable protection film that prevents release layer peeling

UV curing adhesive PhotolecB
