Search by Application ｜ Automotive Electronics
- Microsphere
[Micropearl™]Microsphere
- [Micropearl™]
- Plastic particles with uniform particle size distribution. High-performance filler combines properties such as stability, flexibility, and resilience. Can be used as in-plane spacers, stress relaxation materials, and unevenness-forming materials.
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Power Device
- GAP control adhesive containing uniform particles
GAP control adhesive containing uniform particles
- Thermosetting adhesive containing ultra high precision spacer particles. The thickness of the adhesive can be precisely controlled.
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Power Device
- Adhesive Products
[Photolec™ Series]Adhesive Products
- [Photolec™ Series]
- Sealant for ODF | UV-curing adhesives | UV delayed curing Low moisture permeable adhesive | UV (B stage) + Moisture Curing Adhesive | LED encapsulation material & UTG protective resin | GAP control adhesive containing uniform particles
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Power Device
- Functional Foam Tape
[5200 Series]Functional Foam Tape
- [5200 Series]
- Combination of foam and adhesive with excellent stress relaxation. High impact resistance, high step followability (waterproof, dustproof), high adhesive reliability.
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Power Device
- Release Film for Heat Press Process
[Low Outgas Release Film]Release Film for Heat Press Process
- [Low Outgas Release Film]
- Release film exhibiting excellent heat resistance, flexibility, and low-contamination properties. Suitable for surface protection and buffering in heat press processes for manufacturing FPCs, semiconductor molds, next-generation displays etc.
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Power Device
- Heat Release Related Series
Heat Release Related Series
- Heat Release Related Products
- Silicone - Non silicone, Sheet / Pods / Paste / Grease, etc. unique line up for TIMs
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Power Device
- Waterproof, Anti-vibration, Shock Absorbing Thin Foam [XLIM™]
Waterproof, Anti-vibration, Shock Absorbing Thin Foam
- 【XLIM™】
- Ultra-thin, high-performance foam that combines high sealing properties and high shock absorption.
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Power Device
- Compression Type Conductive Connector
[Dot Connector Series]Compression Type Conductive Connector
- [Dot Connector Series]
- Electrical Connection, Holder Integrated Connector | Rubber Connector for Electrical Connection and Grounding (Adhesive Fixing) | Rubber Connector for Electrical Connection and Grounding (Solder Mounting) | Electrical Connection, Flexible Rubber Connector
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Power Device
- Polyvinyl Acetal Resin
[S-LEC™ Series]Polyvinyl Acetal Resin
- [S-LEC™ Series]
- Tough, high flexibility, high adhesiveness, crosslinkability, compatibility. Easy to dissolve in various solvents including alcohol.
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Power Device
- Mobility
Related Products
Mobility Related Products
- DEVICE
-
Semiconductor-
relatedSemiconductor-related
Electronic
components・
SubstrateElectronic components・Substrate
LCD・
Touch PanelLCD・Touch Panel
OLED・
mini/μLEDOLED・mini/μLED
Power Device
Power Device
Tape
Sheet
High Thermal Conductivity Heat Dissipation Sheet MANION™ Series
Heat Dissipation Sheet TIMLIGHT™ Series
Insulated High Thermal-conductive, low siloxane silicone heat release sheet
Film
Foam
Heat resistant foam tape 5200series
Closed-cell form XLIM™
Next-generation device foam that absorbs impact, even at a thickness of just 0.06 mm
Adhesive
UV curing adhesive PhotolecS
UV curing adhesive PhotolecB
UV curing adhesive Photolec E
UV curing adhesive Photolec A
Functional fine particles - Epowell GP series -
Microsphere・Filler
High-Performance Metal Plated Filler Micropearl™
High-performance functional filler that combines flexibility and conductivity without causing damage
Functional fine particles - Micropearl™ Series -
Grease
Resin
Paste Resin S-LEC™ SV
Polyvinyl Acetal Resin S-LEC B / S-LEC K
Polyvinyl acetal resin (PVB) with excellent physical properties : Toughness, Adhesiveness and Dispersibility
