Search by Application ｜ Automotive Electronics
- Microsphere
[Micropearl™]Microsphere
- [Micropearl™]
- Plastic particles with uniform particle size distribution. High-performance filler combines properties such as stability, flexibility, and resilience. Can be used as in-plane spacers, stress relaxation materials, and unevenness-forming materials.
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Power Device
- GAP control adhesive containing uniform particles
GAP control adhesive containing uniform particles
- Thermosetting adhesive containing ultra high precision spacer particles. The thickness of the adhesive can be precisely controlled.
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Power Device
- Adhesive Products
[Photolec™ Series]Adhesive Products
- [Photolec™ Series]
- Sealant for ODF | UV-curing adhesives | UV delayed curing Low moisture permeable adhesive | UV (B stage) + Moisture Curing Adhesive | LED encapsulation material & UTG protective resin | GAP control adhesive containing uniform particles
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Power Device
- Functional Foam Tape
[5200 Series]Functional Foam Tape
- [5200 Series]
- Combination of foam and adhesive with excellent stress relaxation. High impact resistance, high step followability (waterproof, dustproof), high adhesive reliability.
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Power Device
- Release Film for Heat Press Process
[Low Outgas Release Film]Release Film for Heat Press Process
- [Low Outgas Release Film]
- Release film exhibiting excellent heat resistance, flexibility, and low-contamination properties. Suitable for surface protection and buffering in heat press processes for manufacturing FPCs, semiconductor molds, next-generation displays etc.
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Power Device
- Heat Release Related Series
Heat Release Related Series
- Heat Release Related Products
- Silicone - Non silicone, Sheet / Pods / Paste / Grease, etc. unique line up for TIMs
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Power Device
- Waterproof, Anti-vibration, Shock Absorbing Thin Foam [XLIM™]
Waterproof, Anti-vibration, Shock Absorbing Thin Foam
- 【XLIM™】
- Ultra-thin, high-performance foam that combines high sealing properties and high shock absorption.
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Power Device
- Compression Type Conductive Connector
[Dot Connector Series]Compression Type Conductive Connector
- [Dot Connector Series]
- Electrical Connection, Holder Integrated Connector | Rubber Connector for Electrical Connection and Grounding (Adhesive Fixing) | Rubber Connector for Electrical Connection and Grounding (Solder Mounting) | Electrical Connection, Flexible Rubber Connector
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Power Device
- Polyvinyl Acetal Resin
[S-LEC™ Series]Polyvinyl Acetal Resin
- [S-LEC™ Series]
- Tough, high flexibility, high adhesiveness, crosslinkability, compatibility. Easy to dissolve in various solvents including alcohol.
Device
Semiconductor-related Electronic components・Substrate LCD・Touch Panel OLED・mini/μLED Power Device
- Mobility
Related ProductsMobility Related Products
- DEVICE
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Semiconductor-
relatedSemiconductor-related
Electronic
components・
SubstrateElectronic components・Substrate
LCD・
Touch PanelLCD・Touch Panel
OLED・
mini/μLEDOLED・mini/μLED
Power Device
Power Device
Tape
Sheet
High Thermal Conductivity Heat Dissipation Sheet MANION™ Series
An ultra-high-thermal-conductivity carbon heat dissipation sheet created by magnetic field alignment technology
Heat Dissipation Sheet TIMLIGHT™ Series
A multifunctional heat dissipation sheet that combines flexibility to conform to uneven surfaces and high thermal conductivity
Film
Foam
Waterproof/Shock-Absorbing Foam Tape 5200 Series
A heat-resistant foam tape that delivers both waterproofing and shock absorption
Closed-cell form XLIM™
Next-generation device foam that absorbs impact, even at a thickness of just 0.06 mm
Adhesive
UV + Heat-Curing Low-Contamination Adhesive Photolec™ S
A sealing material ideal for LCD panels, combining narrow-bezel compatibility with non-contaminating properties
UV + Moisture-Curing Flexible Adhesive Photolec™ B
A flexible adhesive that follows fine-line patterns and curved surfaces, expanding design flexibility.
UV and Low-Temperature Curing, Low-Moisture Permeable Adhesive Photolec™ E
A low-moisture-permeability UV-curable adhesive that bonds light-shielding substrates at low temperatures in a short time.
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UV light Curig Highly Transparent/ Black Adhesive Photolec™ A
A uv cure adhesive that combines light-shielding capability with strong adhesion
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Adhesive with Precision Gap Control Particles EPOWELL™ GP
Microsphere・Filler
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High-Performance Metal Plated Filler Micropearl™
High-performance functional filler that combines flexibility and conductivity without causing damage
Plastic-Based High-Performance Filler Micropearl™
High-performance fine particles that meet the needs of next-generation devices with precise thickness control and stress relaxation
Grease
Resin
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Power resin for paste applications S-LEC™ SV
High-performance power resin for paste applications - suppressing stringing and supporting various printing methods
Powder Resin for Binder Applications S-LEC™ B,K
A versatile binder resin that combines adhesion, dispersibility, and toughness
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