Sekisui Mobility Solution
Innovation for the Future Mobility - SEKISUI Solution
Sekisui Mobility Solution
The SEKISUI CHEMICAL Group contributes to next-generation mobility by offering materials, especially using our bonding, heat dissipation, and molding technologies, to respond to the evolution of ADAS (Advanced Driver-Assistance Systems) and the shift to EVs which is accelerating due to environmental issues such as global warming, as well as the design and comfort requirements for the interior/exterior and HMIs (Human-Machine Interface).
Safety(ADAS)
for Camera, Radar, Lidar, ECU
Heat dissipation
EMC measures
Gasp forming & adhesion
Increased lightness
Adhesion
The SEKISUI CHEMICAL Group provides materials that contribute to improving the reliability of ADAS devices, especially the bonding, heat dissipation, and molding technologies we have developed over time.
Safety (ADAS) products.
Environment
for EV/FCV Power module
Heat dissipation
Heatproof /
fire retardant
Improved battery
characteristics
Adhesion
EMC measures
Increased
lightness
The SEKISUI CHEMICAL Group provides materials that contribute to improving the safety and performance of batteries, especially the bonding, heat dissipation, and molding technologies we have developed over time.
Environment products.
Design/Comfort
for Interior/Exterior HMI
Improved
designability
Improved
HMI functionality
Sound insulation /
heat insulation
Increased
lightness
Adhesion
Gap forming &
adhesion
EMC measures
The SEKISUI CHEMICAL Group provides materials that contribute to improving the design and comfort of upcoming vehicles, especially the bonding, heat dissipation, and molding technologies we have developed over time.
Design/Comfort products.
Pick Up
the SEKISUI CHEMICAL HPPC site.
