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UV and Low-Temperature Curing, Low-Moisture Permeable Adhesive Photolec™ E
A low-moisture-permeability UV-curable adhesive that bonds light-shielding substrates at low temperatures in a short time.
The lineup includes both post-curing and instant-curing types after UV irradiation. With a resin design that offers low moisture permeability and excellent contamination resistance, it contributes to enhancing the long-term reliability of liquid crystals and organic materials. The lineup also covers options for refractive index adjustment and dam-and-fill applications, making the adhesive suitable for diverse needs.
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- For processes where UV irradiation is not possible
- Delayed curing adhesive for UV-impermeable materials
- Technical information
- Document download
For processes where UV irradiation is not possible
In the processes of attaching camera modules, which are key components of in-vehicle cameras used in advanced driver assistance systems (ADAS), and organic light-emitting diode (OLED) displays used in center information displays (CIDs), some processes do not allow UV irradiation due to UV-impermeable or UV-sensitive materials being used in the surfaces.
Furthermore, water penetration from the bonding area, which can cause defects in these components, must be prevented, and especially for OLED panels, high-optical performance is required.
Delayed curing adhesive for UV-impermeable materials
The UV delayed curing low-moisture-permeable adhesive, Photolec E, is a UV delayed curing adhesive that can be applied to UV-impermeable materials and UV-sensitive surfaces.
With its delayed curing (adjustable from 5 to 20minutes) instead of curing immediately after UV irradiation, Photolec E can be used for processes that cannot be performed with immediate curing by UV irradiation.
Low-moisture permeability, contamination-resistant resin prevents contamination or water penetration from external factors.
With a wide range of product lineups, it is capable of offering a variety of solutions to meet the needs of each application.
Technical information
Technical overview
UV post-curing
Adhesion adjustment
After UV irradiation5-20 minutes adjustable.
Low pollution
Pollution and moisture resistance
prevent contamination and pollution LC,organic materials.
Optical properties
Refractive index adjustment
Adjustable from 1.44 to 1.71.
Wide product lines
Dam and fill materials
proposals can be madeaccording to the application.
Technical details
UV post-curing
Low pollution
Prevents contamination of each material by preventing moisture from entering
Optical properties
Wide product lines
| Standard | High moisture resistance |
Low temperature cure |
|||
|---|---|---|---|---|---|
| E305 | E220 | E303 | |||
| Viscosity | 25℃/5rpm | MPa・s | 250 | 290,000 | 7,000 |
| Ti | 1rpm/10rpm | 1.0 | 2.1 | 1.0 | |
| WVTR | 60℃90% 300μm |
g/m2-24h | 22 | 6 | 33 |
| Storage conditions | 10°C or less | ||||
| Use conditions | Normal temperature | ||||
Characteristics
- Curing will start a few minutes after UV irradiation. By heating at low temperature for a short time, it cures quickly.
- Low Outgas, Moisture-proof
Temporary curing procees
Dispense→UV Curing→Bonding→Heat Curing
Applications
1After-cure
This type is best for sealing materials which are subject to heat, for polarizing parts, and for plastic plates.
2Low moisture permeability
Moisture-proof sealant for OLED Display
- This product releases minimal gas generated during curing proccess (UV/heat)
- Semiconductor (MEMS, CCD) sealing
Low Outgas
Strong and highly accurate adhesion can be achieved
※ With Plastic-based Micropearl™
- Bonding for plastic substrates
- Bonding for optical components
- Hard disks, surrounding sealants (low moisture permeability), internal adhesive (low outgas)
- Semiconductor(MEMS,CCD camera module)
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