高硬度表面コート樹脂 フォトレック™　用途

High-Hardness Surface Coating Resin Photolec™

Protective resin for μLED that provides both sealing performance and cover glass functionality.

UV-curable resin for protecting μLED chips, applicable by inkjet coating. The extensive product lineup enables the replacement of conventional multilayer structures, contributing to making devices thinner and lighter. It is suitable for next-generation applications such as TVs, digital signage, and AR/VR.
  • Electronics

Summary

μLEDs are self-luminescent LED chips of less than 100µm. They are expected to be applied to next-generation displays such as TVs, signage, and AR/VR.

Chip encapsulation of μLED displays is expected to become more difficult with conventional processes as chips become smaller and narrower in pitch.Therefore, a resin is needed to seal between the chips using a process such as inkjet application.

Photolec™ for μLED is an ink-jet compatible, low viscosity, solvent-free UV curable encapsulating resin.Chip encapsulation and underfill can be done at the same time in a batch.

We also have a lineup of ultra-hard grades, which can provide the above-mentioned sealing performance and cover glass functions in a single process.Therefore, by replacing the conventional stacked structure with Photolec™ , thinner and lighter devices can be realized.

Characteristic

  • Solventless, UV-curable protective resin
  • High surface smoothness, high transparency, chip protection, underfill
  • Prevents color mixing by blackening, Anti-gloss
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Process
Process

Application

TV, Sinage, AR/VR

Document download

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  • Electronics
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Catalog 〈Electronics〉：High-Hardness Surface Coating Resin Photolec™ Electronics pdf 2025-09-30 Download344.23 KB
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