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Double-sided Tape for Fixing Polishing Pads
A double-faced tape with a differential design that provides excellent adhesion and easy removability
A double-faced tape designed for use in substrate manufacturing processes, combining strong adhesion with excellent removability. It is ideal for securing CMP pads and polishing pads, and is available in film substrates, wide width specifications, and a variety of customizations. With minimal adhesive residue after removal, it contributes to improved work efficiency and consistent product quality.
- Electronics
The polishing cloth setting double-faced tapes are widely used in electronic material manufacturing processes, including LCD glass substrate manufacturing processes.
Though the products are superior in adhesion reliability, they can be peeled off easily later.
Features
- The film base material allows re-peeling.
- The tapes with width of up to 2450 mm are available.
- The double release liner type features highly smooth adhesive surface.
- We can develop the products that meet the specifications required from customers.
Applications
- The tapes set polishing pads and backing films for LCD glass substrates.
- The tapes set polishing pads for silicon wafers, hard disk substrates, and the like.
- The tapes set the CMP pads.
- The tapes set rubbing cloths.
Characteristics
General physical properties
| Item | Pressure-sensitive design | Thermosensitive design | ||
|---|---|---|---|---|
| General type |
Differential type |
Differential type |
||
| Thickness of tape(um) | 130 | 108 | 138 | |
| Adhesion (Stainless Steel, 23'C) |
Strong adhesion surface | 6 | 12 | 30 |
| Weak adhesion surface | 5 | 6 | 20 | |
| Adhesive | Acrylic | Acrylic | Acrylic | |
| Base material | OPP | PET | PET | |
| Release liner | Single release liner | Double release liner | Single release liner Double release liner |
|
| Paper | Paper/film | Paper/film | ||
| Application example | Polishing of silicon wafer | CMP Polishing of hard disk substrate |
CMP Polishing of LCD glass substrate |
|
- The method for measuring adhesion complies with JIS Z0237.
- The above figures are only measurements; their values are not guaranteed.