UV + Moisture-Curing Flexible Adhesive Photolec™ B
A flexible adhesive that follows fine-line patterns and curved surfaces, expanding design flexibility.
An adhesive that combines UV curing with moisture curing. It provides rapid initial adhesion, eliminating the need for jigs or pressure retention and improving production efficiency. With no dripping and highly precise fine-line dispensing, it is applicable to bonding in narrow bezels and complex 3D curved surfaces. The adhesive also supports a wide range of uses, including bonding for automotive and large displays, as well as fixation of smartphones and optical components.
- Mobility
- Electronics
- Improved adhesion with changes in material and shape
- Adhesives for fixing complex shapes and dissimilar materials
- Technical information
- Document download
Improved adhesion with changes in material and shape
With advanced driver assistance systems (ADAS) continuing to evolve, center information displays (CIDs) now offer entertainment in addition to conventional navigation and air conditioning functions, and feature more sophisticated designs and are becoming larger in size.
Displays are becoming narrower in border size, more complex in shape, using increasingly composite materials, and larger in size in order to satisfy their design and multi-purpose needs. In terms of attaching components, there are challenges such as narrower lines, applicability to complex shapes, bonding different materials, and improving bonding strength, and using conventional tape to attach these components is becoming insufficient to meet these needs.
Adhesives for fixing complex shapes and dissimilar materials
The UV (B stage) + moisture-curing adhesive Photolec B is a display edge adhesive that combines the strengths of a double-faced tape and an adhesive to provide both high-initial-bonding strength and reliability.
Its rapid activation of initial bonding strength eliminates the use of jigs and the need to maintain pressure.
With no glue overflow and a high degree of freedom in dispensing, it is capable of narrow side dispensing of 0.5 mm or less, making it suitable for bonding at narrow borders. It can also be used for bonding complex 3D curved surfaces, increasing the design flexibility.
Its excellent bonding property for different materials allows it to be used for various types of surfaces.
Its flexibility even after curing prevents warpage of components by stress relaxation.
Technical information
Technical overview
High initial bonding strength
No fixture required, pressure keeping.
→ Improve production efficiency.
→ Improve production efficiency.
Can correspond to narrow side
dispensing below 0.5mm
No glue overflow + high degree of
freedom in dispensing.
→ Suitable for bonding at narrow borders.
3D curved surface bonding is also possible.
freedom in dispensing.
→ Suitable for bonding at narrow borders.
3D curved surface bonding is also possible.
Suitable for bonding of
different materials
Can improve the freedom of material selection.
Increase design freedom.
Increase design freedom.
Maintain softness after fully cured
Can absorb the stress caused by
the deformation of the adherend.
the deformation of the adherend.
Technical details
High initial bonding strength
- No fixture required, pressure keeping
- →Improve production efficiency
- Shape retention
- →High degree of freedom of design
Can correspond to narrow side
dispensing below 0.5mm
No glue overflow + high degree of freedom in dispensing
→Suitable for bonding at narrow borders
3D curved surface bonding
is also possible.
Suitable for bonding of different materials
Maintain softness after fully cured
Can absorb the stress caused by the deformation of the adherend.
What is Photolec™ B?
Small device applications
（smartphone, Wearable device, Earphones etc.）
Medium and large device applications
（TV, Digital signage, monitor, NotebookPC, Tablet etc.）
Overview
Features
1High initial bonding strength
2Can correspond to narrow side dispensing below 0.5mm
3Suitable for bonding of different materials
4Maintain softness after fully cured
5Can maintain a certain glue height
Application
Smart phones
Optical components
Fine parts fixing
Large displays
Automotive display
