UV Instant-Curing Highly Transparent/ Black Adhesive Photolec™ A
A UV adhesive that combines light-shielding capability with strong adhesion
- Mobility
- Electronics
- Moisture intrusion into the camera module
- UV fast-curing adhesive with excellent sealing reliability
- Technical information
- Document download
Moisture intrusion into the camera module
There are various sensors used in advanced driver assistance systems (ADAS), and in-vehicle cameras are one of the main sensors used in ADAS.
The technical challenges for the lens unit of camera modules include shortening of the curing time when attaching the lens, improvement of bonding strength, water entering the unit, and the light passing through the adhesive.
UV fast-curing adhesive with excellent sealing reliability
The UV-curing adhesive Photolec A is a UV-curing high-transparency adhesive ideal for attaching optical devices.
It cures quickly with UV light even when exposed to oxygen.
It has excellent adhesion to glass and securely holds lenses in place.
High resistance to water and excellent sealing reliability, preventing water from entering the module.
It can be made black (the black variant is also curable by UV irradiation), preventing light from passing through the adhesive around the lens.
Technical information
Technical details
UV curable
Curing speed
Cures quickly with UV even in an oxygen environment.
Adhesive strength
High adhesive strength
Excellent adhesion to glass substrates.
Low moisture permeability
Sealing function
Impervious to moisture and excellent sealing reliability.
Light blocking
Blackening
Even black can be cured by UV irradiation.
Techinical details
UV curable
Adhesive strengths
Low moisture permeability
| Standard | Black | |||
|---|---|---|---|---|
| A-785-180 | A784-60BK | |||
| Viscosity | 25℃ | MPa・s | 10,000 | 3,600 |
| Ti | 1rpm/10rpm | 1.03 | 1.03 | |
| WVTR | 60℃90% 300μm |
43 | 39 | |
| Storage conditions | 0 ~ 5°C, Shading | |||
| Use conditions | Normal temperature, UV cut environment | |||
Light blocking
protecting wiring and preventing light leakage.
Image drawing Glass 0.7mmCharacteristics
- Low pollution, Halogen free
- Quick UV curing
- High transparency and refraction
- Suitable for situational manufacturing processes
- Low moisture permeation
- Reflow heat resistance (maintains transparency even after reflow)
- We have a black version of the resin that is also cured instantly with UV
Applications
1For optical uses
Fixing Optical Lens, CMOS Sensors
Excluding light at the edge
2For protecting glass substrates
Protecting base materials when etching them
3For LCD use
LCD sealing,Moisture proof around the narrow bezel panel,light shielding
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Wipe-off the liquid crystal- After injecting the liquid crystal, wipe off extra liquid crystal that is stuck onto the cross section of the panel
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Dispense Photolec™ A -
Permeation of sealant- The encapsulant penetrates due to the negative pressure in the panel
- Penetration level (from cross section), Usually about 0.5 to 1.0 mm
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Hardening of sealant- UV irradiation from cross section（UV irradiation from the side may damage the liquid crystal）
- The amount of light which can reach the liquid crystal interface is insufficient due to over-penetration
- When the interface is insufficiently cured, it may cause a detecting failure of the liquid crystal display screen
Sealant reacts (cures) with heat, the reaction with heat will increase the adhesion strength to the surface of the glass. We recommend applying heat during the annealing process (recommended conditions: 100℃ for at least 30 minutes)
4Additional merits
This product can protect the electrode of FPC substrates
Process
Document download
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