Adhesive with Precision Gap Control Particles EPOWELL™ GP
- Mobility
- Electronics
- Increased mounting difficulty due to smaller and thinner substrates
- Gap retention and high adhesion due to uniform particles
- Technical information
- Document download
Increased mounting difficulty due to smaller and thinner substrates
As packages and PCBs continue to become more sophisticated, more compact, and slimmer, the technologies required for mounting them have also become more sophisticated, including lower gaps to achieve higher speed, uniform gaps for ensuring high reliability, countermeasures against circuit board warpage, and resistance to high temperatures and high humidity.
Gap retention and high adhesion due to uniform particles
The Epowell GP series is a heat-curable adhesive formulated with ultra-precision spacers.
Uniform gap control contributes to improved gap retention and uniform adhesion.
This series is compatible with high-temperature environments, and demonstrates stable adhesive strength even in a high-temperature and high-humidity environment.
A wide lineup of particle sizes from 15 μm to 500 μm enables precise gap control.
Technical information
Technical overview
A uniform gap
・Uniform gap control
・Uniform gap control
Product line
・Particle size
・15μm ~ 500μ
High reliability
・Withstands high temperature environment
・Stable adhesive strength even in a high temperature and high humidity environment
Technical details
A uniform gap
- Uniform gap control
- Few large particle
No particle
Particle
Product line
| Av. diameter | Cv [%] |
Grade | Av. diameter | Cv [%] |
|
|---|---|---|---|---|---|
| [μm] | [μm] | ||||
| SP-215 | 15± 0.1 | 5% | GS-L120 | 120± 6 | 7% |
| SP-220 | 20± 0.15 | GS-L150 | 150± 7 | ||
| SP-225 | 25± 0.2 | GS-L200 | 200 ± 10 | ||
| SP-240 | 40± 0.3 | GS-L300 | 300 ± 15 | ||
| SP-250 | 50± 0.5 | GS-L350 | 350 ± 17.5 | ||
| GS-260 | 60± 3.0 | 7% | GS-L400 | 400 ± 20 | |
| GS-280 | 80± 4.0 | GS-L450 | 450± 22.5 | ||
| GS-L100 | 100 ± 5.0 | GS-L475 | 475 ± 22.5 |
High reliability
Pyrolysis
Moisture resistance and heat stability
Characteristics
1The thickness of the adhesive can be precisely controlled
2Effectively maintain the adhesive insulation
3It is conductive to ensure the consistency of adhesive force
Applications
- Inductors, power supply modules, etc.
Expected effect: stabilization of inductance - Pressure sensor and fixing chip of acceleration sensor
Expected effect: increase the sensor sensitivity - Fixing components in the camera module
Expected effect: Suppression of camera sensor shake
Comparison with current technology
The advantages of our products in gap control
- Process reduction (yield improvement)
- Stable inductance · Reduce tolerance
- Can also be controlled for narrow intervals
- Can be used for ferrite cores of various shapes
Comparing to existing construction method
Process
Polishing
1.Polishing
2.Thickness
test
3.Dispense
adhesive
4.Bonding
5.Hardening
Tape
1.Punching
(die cutting)
Manual work
2.Bonding
by tape
Manual work
3.Dispense
adhesive
4.Bonding
5.Hardening
Glass
beads
1.Mixing
Required amount
of adhesive and
particles need
to be mixed
in advance
2.Filling
3.Dispense
adhesive
4.Bonding
5.Hardening
Our products
Unnecessary process
1.Dispense
adhesive
2.Bonding
3.Hardening
Particle sizes selection
| Average particle diameter[µm] | Cv |
|---|---|
| 10±0.1 | 5％ or less |
| 15±0.1 | |
| 20±0.15 | |
| 25±0.2 | |
| 30±0.25 | |
| 50±0.5 | |
| 75±0.5 | |
| 100±1 | |
| 110±1 |
| Average particle diameter[µm] | Cv |
|---|---|
| 40±2 | 7％ or less |
| 50±2.5 | |
| 60±3 | |
| 70±3.5 | |
| 80±4 | |
| 90±4.5 | |
| 100±5.5 | |
| 120±6 | |
| 130±6.5 | |
| 140±7.0 | |
| 150±7.5 | |
| 160±8.0 | |
| 170±8.5 | |
| 180±9.0 | |
| 190±9.5 | |
| 200±10 |
Document download
- All
- Electronics
- Mobility