バインダー用途粉体樹脂 エスレック™B,K

Powder Resin for Binder Applications S-LEC™ B,K

A versatile binder resin that combines adhesion, dispersibility, and toughness

A functional resin composed of three units -scetal, acetyl and hydroxyl groups. It provides high adhesion, dispersion stability, and robust physical properties, enabling versatile applications such as ceramics, conductive pastes, adhesives, and resin modification. With product grades tailored to customer needs, it contributes to enhanced product performance and manufacturing efficiency.
  • Mobility
  • Electronics

Features

Polyvinyl acetal resin (PVB) exhibits various functions such as toughness, adhesiveness and dispersibility in a balanced manner, and contributes to satisfying the required quality for various applications.

Toughness

Toughness
PVB has moderate strength and resilience to receive external forces flexibly.
 

Adhesiveness

Adhesiveness
Since PVB has excellent flexibility and does not peel easily, it can be firmly adhered to metal, glass, ceramic, etc.

Dispersibility

Dispersibility
PVB adsorbs moderately to the powder and can be dispersed uniformly in the liquid to maintain the distance between the powders.
Other features are…

Pyrolytic Property

Pyrolytic Property High Temp. Oven Green sheet
When used in a binder, PVB can be degreased without residue in the sintering process.

Solubility/Compatibility

Solubility/Compatibility PVB powder
PVB is soluble /
compatible with many solvents and resins.
 

Transparency

Transparency Glass PVB
layer
Colorless, transparent resin that does not damage visibility or appearance.
  • ・Thickening property Thickening property
  • ・Moldability Moldability
  • ・Insulation Insulation

etc …

Applications

PVB is used in a wide range of applications, including binders for MLCC and other ceramics, binders for conductive pastes, dispersants for pigments and carbon materials, modifiers for epoxy and phenolic resins, inkjet receptive layers, and adhesives and so on.

MLCC MLCC
Other ceramic parts Other ceramic parts
Conductive paste Conductive paste
Paints / Inks Paints / Inks
Resin modifier Resin modifier

How to Use S-LEC and Its Effects

By dissolving in a solvent suitable for each application and mixing with other materials, the adhesive properties and dispersibility characteristic of S-LEC can be demonstrated in products and their manufacturing processes.

ow to Use S-LEC and Its Effects

Chemical Structure

The chemical and physical properties of S-LEC can be controlled by adjusting the molecular weight and the ratio of the three units composing PVB: acetal group, acetyl group and hydroxyl group. This allows us to propose suitable grades with properties that meet your needs.

Chemical structure of S-LEC
  • *R= C3H8 : Polyvinyl Butyral
  •  R= CH3 : Polyvinyl Acetacetal

The above two are collectively called “polyvinyl acetal resin”.

◆ Control of material properties

Adjusting the ratio of the units Adjusting the ratio of the units
Adjusting the molecular weightAdjusting the molecular weight

*We also have a lineup of water-based PVB (S-LEC K KW/KX) with a high hydroxyl ratio.

Specifications

■Product grades

Grade Type Calculated
molecular
weight
×104		 Viscosity Polymer composition Tg Volatiles
5wt% 10wt% Hydroxyl
content		 Acetyl
content		 Acetal
content
mPa・s mol% wt% mol% wt% mol% wt% ℃ %
Low
molecular-
weight		 BL-10 P 1.6 ー 9 to 15 c.a.25 c.a.17 4 max 5 max c.a.73 c.a.80 67 3 max
BL-1 P 1.9 ー 10 to 30 c.a.33 c.a.23 4 max 5 max c.a.66 c.a.75 70 3 max
BL-1H P 2.0 ー 10 to 30 c.a.27 c.a.19 4 max 5 max c.a.72 c.a.80 68 3 max
BL-S P 2.4 ー 10 to 30 c.a.19 c.a.13 6 max 7 max c.a.76 c.a.81 66 3 max
BL-2H P 2.8 ー 25 to 55 c.a.27 c.a.19 4 max 5 max c.a.72 c.a.80 70 3 max
BL-5Z Z 3.2 ー 30 to 50 c.a.19 c.a.13 4 max 5 max c.a.79 c.a.85 67 3 max
BL-7Z Z 3.9 ー 50 to 90 c.a.28 c.a.19 4 max 5 max c.a.71 c.a.79 71 3 max
Medium
molecular-
weight		 BM-1 P 4.1 ー 60 to 100 c.a.31 c.a.22 4 max 5 max c.a.68 c.a.77 72 3 max
BM-5 P 5.3 ー 140 to 220 c.a.31 c.a.22 4 max 5 max c.a.68 c.a.77 73 3 max
BM-2(Z) P/Z 5.3 ー 100 to 170 c.a.28 c.a.19 4 max 5 max c.a.71 c.a.79 71 3 max
BM-S(Z) P/Z 5.3 ー 80 to 150 c.a.19 c.a.13 6 max 7 max c.a.76 c.a.81 67 3 max
BM-SHZ Z 5.3 ー 110 to 190 c.a.19 c.a.13 4 max 5 max c.a.79 c.a.85 68 3 max
High
molecular-
weight		 BH-S P 6.7 20 to 40 ー c.a.19 c.a.13 6 max 7 max c.a.76 c.a.81 67 3 max
BH-6 P 9.3 40 to 90 ー c.a.28 c.a.19 4 max 5 max c.a.71 c.a.79 73 3 max
BH-3(Z) P/Z 10.8 60 to 120 ー c.a.31 c.a.22 4 max 5 max c.a.68 c.a.77 74 3 max
BH-A P 11.6 35 to 65 ー c.a.20 c.a.13 1 max3 7 max c.a.67 c.a.70 65 3 max
Heat-resistant
type		 BX-L P 1.8 ー 10 to 30 c.a.33 c.a.25 4 max 5 max c.a.66 c.a.74 95 3 max
BX-1 P 9.8 70 to 140 ー c.a.31 c.a.24 4 max 5 max c.a.68 c.a.75 95 3 max
BX-5(Z) P/Z 13.7 130 to 200 ー c.a.29 c.a.22 4 max 5 max c.a.70 c.a.77 92 3 max
High heat-
resistant type		 KS-10 P 1.8 ー 10 to 30 c.a.16 c.a.13 4 max 5 max c.a.83 c.a.86 105 3 max
KS-1 P 3.2 ー 65 to 95 c.a.16 c.a.13 4 max 5 max c.a.83 c.a.86 107 3 max
KS-6Z Z 11.1 110 to 170 ー c.a.15 c.a.12 4 max 5 max c.a.84 c.a.87 113 3 max
KS-5Z Z 13.4 210 to 270 ー c.a.15 c.a.12 4 max 5 max c.a.84 c.a.87 113 3 max
  • Note
  • Type : P = Powder, Z= Granule
  • Viscosity : Ethanol / Toluene = 1/1 solution ( B-type viscometer / 20ºC)
  • *The above values are reference values, not guaranteed values.

■Solubility

Grade BL-1 BL-2H BL-5Z BL-10 BM-1 BM-2 BM-S BH-3 BH-A BX-L BX-5 KS-6Z KS-10
Alcohol Methanol S S I S S S I S S S S S S
Ethanol S S S S S S S S S S S I S
1-Propanol S S S S S S S S S S S S S
2-Propanol S S S S S S S PS S S I I I
1-Butanol S S S S S S S S S S S S S
1-Octanol S S S S S S S PS S S S I S
Ethylene glycol I I I I I I I I I I I I I
Ketone Acetone S S S S I S S I S S PS S S
Methyl ethyl ketone S S S S S S S PS S S S S S
Methyl Isobutyl ketone I I S S I I S I S I I I I
Cyclohexanone S S S S S S S PS S S S S S
Amide Dimethylacetamide S S S S S S S S S S S S S
NN,N-Dimethylformamide S S S S S S S S S S S S S
N- Methylpyrrolidone S S S S S S S S S S S S S
Ester Methyl acetate I S S S I S S I S S S S S
Ethyl acetate I S S S I S S I S PS S S S
n-Butyl acetate I I S S I I S I S PS PS PS S
1,3-Butylene glycol diacetate I I S S I I S I PS I PS PS S
Ether 1,4-Dioxane S S S S S S S PS S S S S S
Tetrahydrofuran S S S S S S S S S S S S S
Hydrocarbon Toluene I I S S I I S I I I I I I
Xylene I I S I I I I I I I I I I
Hexane I I I I I I I I I I I I I
Others Ethylcellosolve S S S S S S S S S S S S S
Dimethyl sulfoxide S S PS S S S PS S S S S S S
Acetic acid S S S S S S S S S S S S S
Terpineol S S S S S S S PS S PS S I S
Butyl carbitol S S S S S S S PS S S S S S
Butyl carbitol acetate I PS S S I I S I PS I PS PS S
  • *Resin concentration : 5 wt%
  • *Solubility: S (Soluble), PS (Partially Soluble), I (Insoluble)

*Please refer to the catalog for other material properties.

S-LEC has other excellent features and is used in many applications.
For more information, please visit the product details page below.

Click here for product details

Click here to learn more about this product in the electronics field.

Document download

  • All
  • Electronics
  • Build/Infra
Name Type File Update File
Catalog 〈Electronics〉：Powder Resin for Binder Applications S-LEC™B,K Electronics pdf 2025-09-30 Download369.22 KB
Catalog 〈Build/Infra〉：S-LEC(EN) Build/Infra pdf 2024-02-21 Download2.96 MB
Catalog 〈Build/Infra〉：S-LEC_KW-KX(EN) Build/Infra pdf 2024-02-21 Download769.10 KB
Ask an Expert