News
Category
- Year
- 2024-03-05
MIC Building / Infrastructure Electronics Mobility Packaging Health care
- NEXT Kansai Innovation Meeting 2023
- 2023-07-28
MIC Building / Infrastructure Electronics Mobility Packaging Health care
- 【MIC Event Report】Visit from Mr. Nishimura, Minister of Economy, Trade and Industry
- 2023-07-13
MIC Building / Infrastructure Electronics Mobility Packaging Health care
- 【MIC Event Report】ACCELERATOR2023
- 2023-04-05
MIC Building / Infrastructure Electronics Mobility Packaging Health care
- KYOTO Open Innovation Conference
- 2023-03-20
Pressrelease Building / Infrastructure Electronics Mobility
- Notice Concerning the Release of the World’s First Transfer Tape with High Heat Resistance, Thin-film, Low VOC, and Adhesion to Rough Surfaces